Intel and others plan to release a new version of the ubiquitous Universal Serial Bus technology in the first half of 2008, a revamp the chipmaker said will make data transfer rates more than 10 times as fast by adding fiber-optic links alongside the traditional copper wires.
Intel is working fellow USB 3.0 Promoters Group members Microsoft, Hewlett-Packard, Texas Instruments, NEC and NXP Semiconductors to release the USB 3.0 specification in the first half of 2008, said Pat Gelsinger, general manager of Intel’s Digital Enterprise Group, in a speech here at the Intel Developer Forum.
In an interview after the speech, Gelsinger said there’s typically a one- to two-year lag between the release of the specification and the availability of the technology, so USB 3.0 products should likely arrive in 2009 or 2010. A prototype shown at the speech is working now, and USB 3.0 will have optical and copper connections “from day one,” he added.
Via (Aviran's Place.)